技术服务

                      Design services

                      来源: 发布时间:2016/4/15 16:21:48 浏览次数:0

                         

                      HuaTian Package Design Team has totel 15 members, all have rich experience that can help customers determine the optimum package for complex integrated circuits, assist customers in designing a package substrate to meet the customer's power, ground and I/O requirements for each pin and conduct thermal and electrical simulations.

                          Package Design Team services include:

                      ?  Customer-centric design.

                      ?  High quality, reliable, and cost effective packaging proposal.

                      ?  DFM (Design For Manufacturing) and DFC (Design for Cost).

                      ?  Supporting auto- check of design and Drawings.

                      Design Capabilities:

                         Multi-Chip ModulesMCM

                         System-in-Package (SiP)

                         Flip Chip Package

                         Hybrid Package

                         Package-in-Package (PiP)

                         Package-on-Package (PoP)

                         Embedded Package

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